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BD2204GUL product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/21 www.rohm.com ? rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201-0e3e0h300030-1-2 07.aug.2012 rev.001 datashee t power supply selector switch ic for sd cards BD2204GUL description BD2204GUL is high side switch ic that has built-in 2 circuits of mosfet. switch has achieved 120m (typ.) on-resistance. 3.3v power supply and 1.8v power supply for memory ca rd can be selected by sel terminal. moreover, it has built-in simultaneous-on prevention function at power switching, reverse-current protection function to prevent reverse-current from output terminal to input terminal at power-off, and discharge circuit to discharge electricity in output terminal. features ? dual channel of low on resistance (typ. = 120m ? ) n-channel mosfet built in ? 3.3v and 1.8v are chosen and an output is possible. ? 0.5a continuous current load ? reverse-current protection when power switch off ? prevent vin1 and vin2 from simultaneous-on. ? output discharge circuit ? thermal shutdown ? active-high control logic ? vcsp50l1 package applications digital cameras digital video camera sd cards slot key specifications ? input voltage range: vin1=2.7 to 4.5v vin2=1.2 to 2.4v ? on resistance: 120m ? (typ.) ? operating current: 25 a(typ.) ? standby current: 0.01 a(typ.) ? operating temperature range: -40 to +85 package w(typ.) d(typ.) h (max.) vcsp50l1 1.50mm x 1.00mm x 0.55mm typical application circuit 3.3v(typ.) 1.8v(typ.) cin cl load vin2 en gnd vout sel vin1 figure 1. typical application circuit vcsp50l1
datasheet d a t a s h e e t 2/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL block diagram pin configuration pin descriptions pin no. symbol i / o pin function a1 vin1 i switch1 input and supply voltage for ic a2 vin2 i switch2 input a3 en i active-high enable input with pull-down resistance (typ.700 ? ) b1 vout o switch output b2 gnd - ground b3 sel i output selector input with pull-down resistance (typ.700 ? ) as sel=l, v out =3.3v output, as sel=h, v out =1.8v output absolute maximum ratings parameter symbol ratings unit switch1 input voltage v in1 -0.3 to 6.0 v switch2 input voltage v in2 -0.3 to 6.0 v en voltage v en -0.3 to 6.0 v sel voltage v sel -0.3 to 6.0 v vout voltage v out -0.3 to 6.0 v output current i out 1.0 a storage temperature t stg -55 to 150 o c power dissipation pd 575 *1 mw *1 in the case of exceeding ta = 25c, 4.6mw should be reduced per 1c. logic charge pump tsd en vou t gnd en vin 2 sel vin 1 + - b1 b2 b3 a1 a2 a3 figure 3. pin configur ation (bottom view) figure 2. block diagram
datasheet d a t a s h e e t 3/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL recommended operating ratings parameter symbol ratings unit min. typ. max. switch1 input voltage v in1 2.7 3.3 4.5 v switch2 input voltage v in2 1.2 1.8 2.4 v operating temperature t opr -40 25 85 c output current i out - - 0.5 a electrical characteristics (v in1 = 3.3v, v in2 = 1.8v, ta= 25 , unless otherwise specified.) parameter symbol limits unit condition min. typ. max. operating current1 i dd1 - 30 45 a v en = 1.2v, v sel = 0v v out = open operating current2 i dd2 - 35 52.5 a v en = v sel = 1.2v v out = open standby current i stb - 0.01 1 a v en = 0v, v out = open en, sel input voltage v enh v selh 1.2 - - v high input v enl v sell - - 0.4 v low input en, sel input h current i enh i selh 2.3 4.7 11.0 a v en = v sel = 3.3v with pull-down resistance en, sel input l current i enl i sell -1.0 - 1.0 a v en = v sel = 0v pull-down resistance r pd 0.3 0.7 1.4 m ? input pin pull-down resistance on-resistance1 r on1 - 120 200 *2 m ? i out = 500ma on-resistance2 r on2 - 120 200 *2 m ? i out = 500ma switch leakage current i leak - 0.01 1 a v en = 0v, v out = 0v output rise time1 t on1 - 60 300 s sel = l, r l = 10 ? v out : 10% 90% output fall time1 t off1 - 0.1 1 s sel = l, r l = 10 ? v out : 90% 10% output fall time1disc t off1d - 300 1000 s en = sel = l, c l = 1 f v out : 90% 10% output rise time2 t on2 - 30 150 s sel = h, r l = 10 ? v out : 10% 90% output fall time2 t off2 - 0.1 1 s sel = h, r l = 10 ? v out : 90% 10% output fall time2disc t off2d - 220 1000 s en = l, sel = h, c l = 1 f v out : 90% 10% discharge on-resistance r disc - 80 150 ? i out = -1ma, v en = 0v discharge current i disc - 10 15 ma v out = 3.3v, v en = 0v vout drop voltage *3 voutdrop1 - - 0.4 v c l = 15 f, i out = 500ma v out = v in1 v in2 voutdrop2 - - 0.4 v c l = 15 f, i out = 500ma v out = v in2 v in1 *2 not 100% tested at the time of shipment.
datasheet d a t a s h e e t 4/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL *3 when the switch changes from vin1 to vin2 or from vin2 to vin1, it is possible that vout voltage drops. dropped voltage of vout is spec ified as voutdrop1 and voutdrop2. that voltage drop is caused by the function which prev ents vin1 and vin2 from turning on simultaneously. this function generates the perio d which both vin1and vin2 are tu rned off, and prevents the penetration current between vin1 and vin2. vout=vin2 vin1 vout=vin1 vin2 figure 4. vout drop voltage *t d1 and t d2 + t comp are period of simultaneous-off. *t comp is period of vout becoming same voltage as vin2. *the value of min. is in condition of i out =500ma and c l =15uf. measurement circuit operating current, standby current en, sel input voltage, output rise, fall time on-resistance, vout drop voltage discharge resistance figure 5. measurement circuit vin1 ven a a vin2 vin2 en gnd vout sel vin1 vin1 vin2 cin cl ven vsel rl vin2 en gnd vout sel vin1 vin1 vin2 cin vin2 en gnd vout sel cl ven vsel vin1 vin1 vin2 cin 1ma ven vin2 en gnd vout sel vin1 vin2(1.8v) vin(3.3v) voutdrop2 min. 1.4v out1 (internal signal) out2 (internal signal) vin(3.3v) vin2(1.8v) voutdrop1 min. 1.4v t d1 t d2 t comp vout
datasheet d a t a s h e e t 5/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[ ] operating curent : idd2[ a] 0 20 40 60 80 100 2345 supply voltage : vin1[v] operating current : idd2[ a] 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[ ] operating curent : idd1[ a] 0 20 40 60 80 100 2345 supply voltage : vin1[v] operating current : idd1[ a] ta=25c figure 6. operating current1 en enable figure 8. operating current2 en enable ta=25c vin1=3.3v vin2=1.8v figure 7. operating current1 en enable figure 9. operating current2 en enable vin1=3.3v vin2=1.8v
datasheet d a t a s h e e t 6/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0.0 0.2 0.4 0.6 0.8 1.0 2345 supply voltage : vin1[v] enable input voltage : ven, vsel[v] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : ven, vsel[v] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby curent : istb[ a] 0.0 0.2 0.4 0.6 0.8 1.0 2345 supply voltage : vin1[v] standby current : istb[ a] low to high high to low ta=25c figure 10. standby current figure 11. standby current ta=25c figure 12. en, sel input voltage figure 13. en, sel input voltage vin1=3.3v vin2=1.8v vin1=3.3v vin2=1.8v low to high high to low
datasheet d a t a s h e e t 7/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : ron2[m ? ] 0 50 100 150 200 2345 supply voltage : vin1[v] on resistance : ron2[m ? ] 0 50 100 150 200 2345 supply voltage : vin1[v] on resistance : ron1[m ? ] 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ ] on resistance : ron1[m ? ] vin1=3.3v vin2=1.8v figure 15. on-resistance1 figure 14. on-resistance1 ta=25c ta=25c figure 16. on-resistance2 figure 17. on-resistance2 vin1=3.3v vin2=1.8v
datasheet d a t a s h e e t 8/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0 20 40 60 80 100 2345 supply voltage : vin1[v] output rise time : ton1[ s] 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[ ] output rise time : ton1[ s] 0 50 100 150 200 250 300 2345 supply voltage : vin1[v] output fall time : toff1[ns] 0 50 100 150 200 250 300 -50 0 50 100 ambient temperature : ta[ ] output fall time : toff1[ns] figure 21. output fall time1 vin1=3.3v vin2=1.8v figure 18. output rise time1 ta=25c figure 20. output fall time1 ta=25c vin1=3.3v vin2=1.8v figure 19. output rise time1 rl=10 ? rl=10 ? rl=10 ? rl=10 ?
datasheet d a t a s h e e t 9/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0 100 200 300 400 500 2345 supply voltage : vin1[v] output fall time : toff1d[ s] 0 100 200 300 400 500 -50 0 50 100 ambient temperature : ta[ ] output fall time : toff1d[ s] 0 20 40 60 80 100 2345 supply voltage : vin1[v] output rise time : ton2[ s] 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[ ] output rise time : ton2[ s] figure 24. output rise time2 ta=25c vin1=3.3v vin2=1.8v figure 25. output rise time2 ta=25c figure 22. output fall time1disc vin1=3.3v vin2=1.8v figure 23. output fall time1 disc rl=10 ? rl=10 ? cl= 1 f cl= 1 f
datasheet d a t a s h e e t 10/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0 50 100 150 200 250 300 2345 supply voltage : vin1[v] output fall time : toff2[ns] 0 50 100 150 200 250 300 -50 0 50 100 ambient temperature : ta[ ] output fall time : toff2[ns] 0 100 200 300 400 500 2345 supply voltage : vin1[v] output fall time : toff2d[ s] 0 100 200 300 400 500 -50 0 50 100 ambient temperature : ta[ ] output fall time : toff2d[ s] figure 28. output fall time2 disc ta=25c vin1=3.3v vin2=1.8v figure 29. output fall time2 disc ta=25c figure 26. output fall time2 vin1=3.3v vin2=1.8v figure 27. output fall time2 rl=10 ? rl=10 ? cl= 1 f cl= 1 f
datasheet d a t a s h e e t 11/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0 40 80 120 160 200 2345 supply voltage : vin1[v] disc on resistance : rdisc[ ? ] 0 40 80 120 160 200 -50 0 50 100 ambient temperature : ta[ ] disc on resistance : rdisc[ ? ] 0 5 10 15 20 25 30 2345 supply voltage : vin1[v] output discharge current : idisc[ma] 0 5 10 15 20 25 30 -50 0 50 100 ambient temperature : ta[ ] output discharge current : idisc[ma] figure 32. discharge current ta=25c vin1=3.3v vin2=1.8v figure 33. discharge current ta=25c figure 30. discharge resistance vin1=3.3v vin2=1.8v figure 31. discharge resistance
datasheet d a t a s h e e t 12/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 0.0 0.2 0.4 0.6 0.8 1.0 2345 supply voltage : vin1[v] voutdrop voltage : voutdrop1[v] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] voutdrop voltage : voutdrop1[v] 0.0 0.2 0.4 0.6 0.8 1.0 2345 supply voltage : vin1[v] voutdrop voltage : voutdrop2[v] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] voutdrop voltage : voutdrop2[v] figure 36. vout drop voltage2 ta=25c vin1=3.3v vin2=1.8v figure 37. vout drop voltage2 ta=25c figure 34. vout drop voltage1 vin1=3.3v vin2=1.8v figure 35. vout drop voltage1 iout=500ma cl=15uf iout=500ma cl=15uf iout=500ma cl=15uf iout=500ma cl=15uf
datasheet d a t a s h e e t 13/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical performance curves - continued 1.0 1.2 1.4 1.6 1.8 2.0 0 100 200 300 400 500 output crrent : iout[ma] voutdrop voltage : voutdrop1[v] 1.0 1.2 1.4 1.6 1.8 2.0 0 100 200 300 400 500 output crrent : iout[ma] voutdrop voltage : voutdrop2[v] figure 38. vout voltage drop switch over from vin1 to vin2 figure 39. vout voltage drop switch over from vin2 to vin1 from above cl=0.1 f cl=1 f cl= 4.7 f cl= 10 f cl= 14.7 f from above cl=0.1 f cl=1 f cl= 4.7 f cl= 10 f cl= 14.7 f
datasheet d a t a s h e e t 14/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical wave forms time(50 s/div.) figure 40. output rise characteristic sel=l v en (2v/div.) time(50 s/div.) figure 41. output rise characteristic sel=h time (200ns/div.) figure 42. output fall characteristic sel=l time (200ns/div.) figure 43. output fall characteristic sel=h v out (1v/div.) v en (2v/div.) v out (1v/div.) v en (2v/div.) v en (2v/div.) v out (1v/div.) v in1 =3.3v v in2 =1.8v r l =10 v in1 =3.3v v in2 =1.8v r l =10 v in1 =3.3v v in2 =1.8v r l =10 v in1 =3.3v v in2 =1.8v r l =10 v out (1v/div.)
datasheet d a t a s h e e t 15/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL typical wave forms - continued time (50 s/div.) figure 44. power switch over characteristic from vin1 to vin2 time (50 s/div.) figure 45. power switch over characteristic from vin2 to vin1 time (5 s/div.) figure 46. power switch over characteristic from vin1 to vin2 time (10 /div.) figure 47. power switch over characteristic from vin2 to vin1 i out =100ma i out =300ma i out =500ma i out =500ma v sel (2v/div.) v out (1v/div.) i out (0.5a/div.) v sel (2v/div.) v out (1v/div.) i out (0.5a/div.) v sel (2v/div.) v out (1v/div.) v sel (2v/div.) v out (1v/div.) i out =100ma iout=500ma cl=15 f cl=1 f cl=1 f iout=500ma cl=15 f
datasheet d a t a s h e e t 16/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL application example 3.3v 1.8v cin cl vin2 en gnd vout sel vin1 ldo ldo controller load figure 48. application circuit example application information when ringing occurs power source line to ic, and may cause bad influences upon ic actions. in order to avoid this case, connect a bypath capacitor by vin1 terminal and gnd terminal of ic, 0.1 f or higher is recommended . the switch over time for vout drop voltage and power at power switch over varies depending on the load current (iout) and the load capacity (cl) of output. please decide load capacity (cl) suited to load current (iout). this system connection diagram doesn?t guar antee operating as the application. the external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of ic including not only stat ic characteristics but also transient characteristics. functional description 1. switch operation vin1 terminal, vin2 terminal and vout terminal are connec ted to the drain and the s ource of switch mosfet respectively. and the vin1 terminal is used also as power source input to internal control circuit. when the switch is turned on from en control input at sel =l (sel=h) input, vin1 (vin2) terminal and vout terminal are connected by a 120m ? switch. in on status, the switch is bi-direc tional. therefore, when t he potential of vout terminal is higher than that of vin1 (vin2) terminal, curre nt flows from vout terminal to vin1 (vin2) terminal. since a parasitic diode between the drain and t he source of switch mosfet is canceled , in the off status, it is possible to prevent current from flowing reversely from vout to vin1 (vin2). 2. switch over operation when h is input to sel terminal while vin1 voltage has been output to vout terminal, vin2 voltage is output to vout terminal to prevent current from flowing reversely after dete cting that vout terminal gets lower than vin2 voltage. when l is input to sel terminal while vin2 voltage has been output to vout terminal, vin voltage is output to vout terminal immediately. 3. thermal shutdown circuit (tsd) if over current would continue, the tem perature of the ic would increase dras tically. if the junction temperature were beyond 135c (typ.), thermal shutdown circuit operates and makes power switch turn off. then, when the junction temperature decreases lower than 115c (typ.), power switch is turned on. unless the fa ct of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. the thermal shutdown circuit operates when t he switch is on (en signal is active). 4. discharge circuit discharge circuit operates when switch off. when discharge circuit operates, 80 ? (typ.) resistor is connected between vout pin and gnd pin. this dischar ges the electrical charge quickly.
datasheet d a t a s h e e t 17/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL timing chart 1) stand-by switch1 on stand-by vin2 en sel vout 1.8v 3.3v 0v 0v 3.3v 0v vin1 3.3v 60s 0.1s 2) stand-by vin1 output (switch1 on) vin2 output (switch2 on) stand-by vin2 en sel vout 3.3v 1.8v 1.8v 3.3v 3.3v 0v 0v 0v 0v vin1 3.3v 60s 0.1s 3) stand-by vin2 output (switch2 on) vin1 output (switch1 on) stand-by vin2 en sel vout 1.8v 3.3v 1.8v 3.3v 3.3v 0v 0v 0v 0v vin1 3.3v 30s 0.1 figure 49. timing chart
datasheet d a t a s h e e t 18/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL 0 100 200 300 400 500 600 700 0255075100125150 ambient temperature : ta [ ] power dissipation : pd [mw] 0 100 200 300 400 500 600 700 0255075100125150 ambient temperature : ta [ ] power dissipation : pd [mw] power dissipation (vcsp50l1 package) figure 50. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no equivalent circuit vin1 a1 to vout internal circuit vin2 a2 to vout en, sel a3, b3 to internal vout b1 * 50mm x 58mm x 1.75mm glass epoxy board
datasheet d a t a s h e e t 19/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossi ble to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assum ed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mount ing an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, for the digital block power supply and the analog block powe r supply, even though these po wer supplies has the same level of potential, separate the power supply pattern for the di gital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thorou ghly check to be sure the characteristics of the capacitor to b e used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd te rminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to t he direction and offset of the ic s. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong el ectromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then di smount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inev itably formed in relation to potential. the operation of the par asitic element can cause interference with circuit operation, thus resulting in a malfuncti on and then breakdown of the input terminal . therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower th an the gnd respectively, so that any parasitic element will operat e. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or wi thin the guaranteed value of el ectrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establis h a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current wi ll cause no fluctuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gn d wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as th e external capacitor, determine the consta nt with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become detecte d temperatures or higher, the therma l shutdown circuit operates and turns a switch off. the thermal shutdown circuit is aimed at isol ating the lsi from thermal runa way as much as possible. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taki ng into account the power dissipat ion (pd) in actual states o f use.
datasheet d a t a s h e e t 20/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL vcsp50l1 (top view) a c n part number marking lot number 1pin mark ordering information b d 2 2 0 4 g u l - e 2 part number package gul: vcsp50l1 packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp50l1 (bd2200gul) s 0.06 s a b b a 0.05 1pin mark 3 0.250.05 6- 0.250.05 1.500.05 2 ( 0.15)index post 1 0.250.05 b 0.55max 1.000.05 a 0.100.05 0.5 p=0.5 2 (BD2204GUL)
datasheet d a t a s h e e t 21/21 tsz02201-0e3e0h300030-1-2 ? 2012 rohm co., ltd. all rights reserved. 07.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD2204GUL revision history date revision changes 07.aug.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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